JPS6242595A - 印刷配線基板 - Google Patents
印刷配線基板Info
- Publication number
- JPS6242595A JPS6242595A JP18206185A JP18206185A JPS6242595A JP S6242595 A JPS6242595 A JP S6242595A JP 18206185 A JP18206185 A JP 18206185A JP 18206185 A JP18206185 A JP 18206185A JP S6242595 A JPS6242595 A JP S6242595A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- temperature
- paint
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000006071 cream Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206185A JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206185A JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6242595A true JPS6242595A (ja) | 1987-02-24 |
| JPH0149032B2 JPH0149032B2 (en]) | 1989-10-23 |
Family
ID=16111659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18206185A Granted JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242595A (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6439090A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Substrate for reflow |
| JP2002111143A (ja) * | 2000-09-29 | 2002-04-12 | Ibiden Co Ltd | プリント配線板 |
| JP2018078244A (ja) * | 2016-11-11 | 2018-05-17 | 新電元工業株式会社 | 電子装置の製造方法および電子装置 |
-
1985
- 1985-08-20 JP JP18206185A patent/JPS6242595A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6439090A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Substrate for reflow |
| JP2002111143A (ja) * | 2000-09-29 | 2002-04-12 | Ibiden Co Ltd | プリント配線板 |
| JP2018078244A (ja) * | 2016-11-11 | 2018-05-17 | 新電元工業株式会社 | 電子装置の製造方法および電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0149032B2 (en]) | 1989-10-23 |
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